Apple is switching to a dual-purpose focus with its upcoming M5 processor, aiming to power both Macs and the servers running Apple Intelligence, according to the Chinese-language Economic Daily, by way of DigiTimes. The chip is reportedly in small-scale trial production, using a more advanced SoIC (System on Integrated Chip) packaging technology created in tandem with long-time Apple partner TSMC. Beyond just exploiting 3D architecture, like existing SoICs, the M5 allegedly incorporates thermoplastic carbon fiber composite molding technology.
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